4.5 Article

Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Journal

IEEE PHOTONICS TECHNOLOGY LETTERS
Volume 34, Issue 17, Pages 899-902

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LPT.2022.3191645

Keywords

Optical waveguides; Optical device fabrication; Silicon; Optical fibers; Mirrors; Optical polymers; Optical coupling; Co-packaged optics; micro mirror; optical redistribution; polymer waveguide; silicon photonics

Funding

  1. New Energy and Industrial Technology Development Organization (NEDO) [JPNP13004]

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In this study, we proposed a new package substrate called active optical package (AOP) substrate for co-packaged optics. We developed an optical redistribution technology on silicon photonics dies to fabricate the AOP substrate, which features a polymer waveguide and a mirror-based optical coupling between polymer and silicon waveguides. The characterized optical redistribution loss showed an average loss of approximately 4 dB and a wavelength-dependent loss of +/- 1 dB within the wavelength range of 1460-1600 nm. The study demonstrated the feasibility of low wavelength-dependent optical redistribution using the mirror-based optical coupling and polymer waveguide.
We previously proposed a new package substrate called active optical package (AOP) substrate to realize co-packaged optics. An optical redistribution technology on silicon photonics dies was developed to fabricate the AOP substrate. It is composed of a polymer waveguide, with a mirror-based optical coupling between the polymer and silicon waveguides. The fabricated optical redistribution loss was characterized in this study. An average loss of approximately 4 dB and wavelength dependent loss of +/- 1 dB were observed for the wavelength range of 1460-1600 nm. It was shown that the low wavelength-dependent optical redistribution was available owing to the broadband characteristics of mirror-based optical coupling and polymer waveguide.

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