Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

We previously proposed a new package substrate called active optical package (AOP) substrate to realize co-packaged optics. An optical redistribution technology on silicon photonics dies was developed to fabricate the AOP substrate. It is composed of a polymer waveguide, with a mirror-based optical coupling between the polymer and silicon waveguides. The fabricated optical redistribution loss was characterized in this study. An average loss of approximately 4 dB and wavelength dependent loss of +/- 1 dB were observed for the wavelength range of 1460-1600 nm. It was shown that the low wavelength-dependent optical redistribution was available owing to the broadband characteristics of mirror-based optical coupling and polymer waveguide.

Automated summary

In this study, we proposed a new package substrate called active optical package (AOP) substrate for co-packaged optics. We developed an optical redistribution technology on silicon photonics dies to fabricate the AOP substrate, which features a polymer waveguide and a mirror-based optical coupling between polymer and silicon waveguides. The characterized optical redistribution loss showed an average loss of approximately 4 dB and a wavelength-dependent loss of +/- 1 dB within the wavelength range of 1460-1600 nm. The study demonstrated the feasibility of low wavelength-dependent optical redistribution using the mirror-based optical coupling and polymer waveguide.