Journal
IEEE ELECTRON DEVICE LETTERS
Volume 43, Issue 9, Pages 1527-1530Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2022.3196035
Keywords
Gallium oxide; vertical MOSFET; VDBFET; diffusion doping; enhancement mode; planar
Categories
Funding
- Stanford SystemX Alliance
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The lack of an effective current blocking layer in Ga2O3 has been a major barrier to achieving a vertical MOSFET. However, a selective diffusion doping technique utilizing magnesium-doped spin-on-glass has been used to form a current blocking layer, leading to the successful demonstration of a vertical Ga2O3 MOSFET for the first time.
Vertical MOSFET is a critical milestone in the gallium oxide (Ga2O3) roadmap. However, the lack of an effective current blocking layer in Ga2O3, which is essential for any DMOS-like (double-diffused MOSFET) transistors has proved to be the main barrier to the achievement of a vertical MOSFET. Here, we report two novel findings first, a selective diffusion doping technique utilizingmagnesium (Mg) doping spin-on-glass (SOG) as a dopant source to form a current blocking layer (CBL), and second, the first demonstration of a vertical Ga2O3 MOSFET with the Mg diffused CBL-Vertical Diffused Barrier Field-Effect-Transistor (VDBFET). The device exhibits an excellent field-effect-transistor (FET) behavior with a high on-off ratio of 109 and a decent saturation. Due to the unique nature of the Mg-doped region, the transistor is normally-off with a turn- on voltage of similar to 7 V. An on-current of 0.15 kA/cm(2) is measuredwith a gate voltage (V-g) of 12 V, and a drain voltage (V-d) of 15V. The three terminal breakdownvoltagemeasured at a V-g of 0V is 72 V. The successful demonstration of the first Ga2O3 VDBFET significantly brightens the prospect for its application in high power electronics.
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