4.7 Article

Microstructure and mechanical properties of 3D ink-extruded CoCrCuFeNi microlattices

Journal

ACTA MATERIALIA
Volume 238, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2022.118187

Keywords

Additive manufacturing; High-energy X-ray diffraction; Reduction; Metal foam; Finite element modeling

Funding

  1. National Science Foundation [NSF DMR-2004769]
  2. Swiss National Science Foundation as an Early Postdoc Mobility fellowship [172180]
  3. MRSEC program of the Materials Research Center [NSF DMR-1720139]
  4. Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource [NSF ECCS-1542205]
  5. International Institute for Nanotechnology (IIN)
  6. Keck Foundation
  7. State of Illinois, through the IIN

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Microlattices with orthogonal 0-90 degrees architecture are 3D-extrusion printed and synthesized into equiatomic CoCrCuFeNi microlattices through H 2 -reduction and interdiffusion processes. Liquid-sintered microlattices show higher compressive strength and ductility, suitable for complex load-bearing applications.
Microlattices with orthogonal 0-90 degrees architecture are 3D-extrusion printed from inks containing a blend of oxide powders (Co3O4, CuO, Fe2O3, and NiO) and metal powder (Cr). Equiatomic CoCrCuFeNi microlattices with-170 mu m diameter struts are then synthesized by H 2-reduction of the oxides followed by sintering and interdiffusion of the resulting metals. These process steps are studied by in-situ synchrotron X-ray diffraction on single extruded microfilaments (lattice struts) with-250 mu m diameter. After reduction and partial interdiffusion at 600 degrees C for 1 h under H 2 , filaments consist of lightly-sintered metallic particles with some unreduced Cr2O3. A reduced, nearly fully densified (porosity: 1.6 +/- 0.7%) alloy is obtained after solid-state homogenization at 1050 degrees C for 4 h under H 2 , with a microstructure consisting of two face-centered-cubic phases, one Cu-poor and the other Cu-rich. When a 10 min excursion to 1150 degrees C is added to the 1050 degrees C homogenization, a Cu-rich melt forms which enhances densification (porosity: 0.3 +/- 0.2%) and smooths both strut surfaces and sharp cusps at nodes in the microlattices. The liquid-sintered microlattices show higher compressive strength and ductility than the solid-sintered microlattices. These improvements are consistent with finite-element modeling results which show that smoothening of the sharp cusps at nodes by the solidified melt reduces stress concentrations. These CoCrCuFeNi microlattices can be integrated in more complex load-bearing applications, e.g., as cores of sandwich structures with an unusual combination of high specific stiffness, strength, and toughness.(c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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