4.7 Article

Outgassing of implanted He via short circuit transport along phase and grain boundaries in vapor co-deposited Cu-W nanocomposites

Journal

ACTA MATERIALIA
Volume 240, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2022.118306

Keywords

Helium; Implantation; Nuclear reaction analysis; Copper; Tungsten; Nanocomposite; Interfaces; Grain boundaries; Transmission electron microscopy; Precession electron diffraction

Funding

  1. United States Department of Energy, Office of Science, Office of Basic Energy Sciences [DE-SC0018892]
  2. AggieFab Nanofabrication Facility, Microscopy and Imaging Center [RRID: SCR_022128]
  3. Materials Characterization Facility at Texas AM University [RRID: SCR_022202]
  4. U.S. Department of Energy's NNSA [89233218CNA000001]
  5. U.S. Department of Energy (DOE) [DE-SC0018892] Funding Source: U.S. Department of Energy (DOE)

Ask authors/readers for more resources

We investigated the response of Cu-W nanocomposites prepared by physical vapor co-deposition to He implantation. Nuclear reaction analysis revealed that a significant portion of the implanted He escapes during the implantation process. Microstructural analysis of the nanocomposites suggested that the loss of He is likely due to its diffusion out of the material along phase and grain boundaries. Our findings suggest that solid-state interfaces, such as phase and grain boundaries, serve as shortcut diffusion pathways for He transport.
We investigate the response of physical vapor co-deposited copper (Cu)-tungsten (W) nanocomposites to helium (He) implantation. Nuclear reaction analysis (NRA) reveals that a substantial fraction of He implanted into these materials escapes during implantation. Analysis of nanocomposite microstructure shows that the He loss is likely due to its transport out of the material by diffusion along phase and grain boundaries. Our findings suggest that solid-state interfaces such as phase and grain boundaries are short circuit diffusion pathways for transport of He.(c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.7
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available