Transportable, Endurable, and Recoverable Liquid Metal Powders with Mechanical Sintering Conductivity for Flexible Electronics and Electromagnetic Interference Shielding

Liquid metals (LMs, e.g., EGaIn) promise a vast potential in accelerating the development of flexible electronics, smart robots, and wearable and biomedical devices. Although a variety of emerging processing methods are reported, they suffer several risks (e.g., leakage, weak adhesion, and low colloidal and chemical stability) because of their excellent fluidity, high surface tension, and rapid oxidation. Herein, liquid metal powders (LMPs) are fabricated based on a versatile method by vigorously stirring EGaIn with nonmetallic or organic particles through interfacial interactions. During the mixing process, EGaIn microdroplets are wrapped with a nonmetallic or an organic shell by electrostatic adsorption, and a more sticky oxide layer is constantly generated and then broken owing to the shearing friction. These transportable powders exhibit superior stability under extreme conditions (e.g., water and high temperature), being capable of recovering electrical conductivity and strong adhesion on different substrates upon mechanical sintering. A flexible, robust, and conductive coating can be constructed via swabbing with an integrated Joule heating effect and excellent electromagnetic interference shielding performances, and it is applicable in flexible wearable electronics, microcircuits, and wireless power transmission systems.

Automated summary

Liquid metal powders (LMPs) are fabricated by vigorously stirring EGaIn with nonmetallic or organic particles through interfacial interactions. These transportable powders exhibit superior stability under extreme conditions and can recover electrical conductivity and adhesion on different substrates. A flexible, robust, and conductive coating can be constructed using these powders, applicable in flexible wearable electronics, microcircuits, and wireless power transmission systems.