Experimental Study of Thermal and Pressure Performance of Porous Heat Sink Subjected to Al2O3-H2O Nanofluid

With the developing technology, the dimensions of electronic systems are becoming smaller, and their performance and the amount of energy they need increases. This situation causes the electronic components to heat up more and the existing cooling systems to become inadequate. In this study, instead of the fins used in existing systems, 10 PPI and 40 PPI PHS were placed inside a water block, and the Al2O3-H2O nanofluid at a mass fraction of 0.1% was used as the cooling fluid. Experiments were carried out under constant heat flux of 454.54 W/m(2) and 1818.18 W/m(2), with volumetric flow rates varying between 100 mL/min and 800 mL/min. The heat transfer results were compared with the results obtained from the base fluid and the empty surface. The results showed that the nanofluid reduced the surface temperatures compared to the base fluid. Especially when PHSs were used together with the nanofluid, a significant increase in heat transfer occurred compared to the empty surface. The highest heat transfer was observed when both the nanofluid and 40 PPI PHS were used together. In addition, the highest thermal performance value was determined as 1.25 times compared to the empty surface when the nanofluid and 10 PPI PHS were used together.

Automated summary

With the advancement of technology, electronic systems are shrinking in size while their performance and energy requirements are increasing. This study found that using PHS and nanofluid as cooling agents can significantly enhance heat transfer efficiency and reduce surface temperatures.