4.7 Article

Rational design of a functionalized silicone polymer for modifying epoxy-based composites

Journal

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume 19, Issue -, Pages 3867-3876

Publisher

ELSEVIER
DOI: 10.1016/j.jmrt.2022.06.086

Keywords

Epoxy; Composites; Silicone polymer; Silylation

Funding

  1. Zhejiang Provin- cial Natural Science Foundation of China [LY22E030013]
  2. Jiaxing Public Welfare Research Project [2020AD10011]

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A new compound, N-TMSPrVaC, was synthesized and used as a modifier for epoxy resin. The results showed that N-TMSPrVaC significantly improved the mechanical and impact properties of the composites. Scanning electron microscopy and X-ray spectrometry analysis revealed a uniform distribution of N-TMSPrVaC in the epoxy resin. Dynamic thermomechanical analysis demonstrated that the functionalized silicon polymer retained the heat resistance of the epoxy composite material to a certain extent and toughened the epoxy.
In this work, a new compound, N-TMSPrVaC, was synthesized using 3-aminopropyltrimethoxysilane (ATPMS) and valeryl chloride (C5H9ClO). Furthermore, it was grafted onto the silicone polymer (PSOL) to obtain a new epoxy resin modifier. Infrared spectroscopy (FT-IR) and nuclear magnetic resonance spectroscopy (1H NMR) were used to characterize the composition and structure of the compound N-TMSPrVaC. The mechanical properties and dynamic thermomechanical analysis (DMA) of PSOL-(N-TMSPrVaC)/EP composites were systematically studied. PSOL-(N-TMSPrVaC) can significantly improve the tensile properties and impact properties of composites by 8.9% (0.5 phr) and 18.2% (3.0 phr), respectively, according to the results. The distribution of PSOL-(N-TMSPrVaC) in the epoxy was studied using the scanning electron microscope and X-ray spectrometry (SEM-EDS). The DMA test showed that the functionalized silicon polymer retained the heat resistance of the epoxy composite material to a certain extent while toughened the epoxy. (c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

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