Journal
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume 19, Issue -, Pages 2497-2509Publisher
ELSEVIER
DOI: 10.1016/j.jmrt.2022.06.010
Keywords
Plate-shaped silver particle; Micron size; Monodispersed; High tap-density; Low radius-thickness ratio
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The purpose of this study was to prepare monodispersed plate-shaped silver particles with high density and low radius-thickness ratio through wet-chemical reduction. The combination of sulfuric acid and PVP was found to play an important role in controlling the morphology and particle size distribution of silver particles.
Purpose of this paper is to prepare monodispersed plate-shaped silver particles with high density and low radius-thickness ratio through wet-chemical reduction. This shape is suitable for preparing high silver content conductive paste with fine electrical conductivity. In this study, the reactant solutions were added by two parallel pipes to mix the two solutions evenly in the contact area. The sulfuric acid was used as a pH regulator, and polyvinylpyrrolidone (PVP K-30) was used as a capping agent, to control the morphology and particle size distribution of silver particles. The result shows that the combination of sulfuric acid and PVP play an important role on controlling the uniform crystal growth of silver particle. This probably because PVP are adsorbed on the surface of (111) plane to prevent the deposition of silver particles, and the PVP used as dispersant also slow the speed of reducing reaction. This make the flake silver particles grow slowly, and the plateshaped silver particles with high tap-density and low radius-thickness ratio can be obtained. In addition, the resistivity of conductive silver paste that prepared with the assynthesized plate-shaped flake silver particle was discussed in detail. (c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
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