4.7 Article

Pt Modified Sb2Te3 Alloy Ensuring High-Performance Phase Change Memory

Journal

NANOMATERIALS
Volume 12, Issue 12, Pages -

Publisher

MDPI
DOI: 10.3390/nano12121996

Keywords

phase change memory; phase change material; high speed; thermal stability

Funding

  1. National Key Research and Development Program of China [2017YFA0206101]
  2. Strategic Priority Research Program of the Chinese Academy of Sciences [XDB44010200]
  3. National Natural Science Foundation of China [91964204, 61874129, 61874178, 61775008, 61904046]
  4. Science and Technology Council of Shanghai [20501120300, 19JC1416800, 19YF1456100]
  5. Shanghai Sailing Program [19YF1456100]
  6. State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Genetic Engineering of Precious Metal Materials in Yunnan Province (I)-Construction and Application of Precious Metal Materials Professional Database (I) [202002AB080001-1]

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Thermal stability and operation speed are the bottlenecks in the development of phase change memory. This paper explores the use of platinum doping to improve PCM performance, resulting in higher data retention temperature and operation speed through reduced grain size and density change rate.
Phase change memory (PCM), due to the advantages in capacity and endurance, has the opportunity to become the next generation of general-purpose memory. However, operation speed and data retention are still bottlenecks for PCM development. The most direct way to solve this problem is to find a material with high speed and good thermal stability. In this paper, platinum doping is proposed to improve performance. The 10-year data retention temperature of the doped material is up to 104 degrees C; the device achieves an operation speed of 6 ns and more than 3 x 10(5) operation cycles. An excellent performance was derived from the reduced grain size (10 nm) and the smaller density change rate (4.76%), which are less than those of Ge2Sb2Te5 (GST) and Sb2Te3. Hence, platinum doping is an effective approach to improve the performance of PCM and provide both good thermal stability and high operation speed.

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