Journal
MICROMACHINES
Volume 13, Issue 8, Pages -Publisher
MDPI
DOI: 10.3390/mi13081203
Keywords
additive manufacturing; fused deposition modeling; 3D printing; polymer matrix composite; conductive composites; structural electronics
Categories
Funding
- Foundation for Polish Science (FNP) [TEAM/2016-1/7]
- European Union under the European Regional Development Fund
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This study investigates the influence of printing parameters on the resistance of 3D printed conductive structures. It finds that printing temperature and layer height have significant impacts on resistance, and controlling multiple parameters simultaneously is a challenge for designing high-efficiency structural electronics.
With recent developments in conductive composites, new possibilities emerged for 3D printed conductive structures. Complementary to a vast number of publications on materials properties, here we investigate the influence of printing parameters on the resistance of 3D printed structures. The influence of printing temperature on the resistance is significant, with too low value (210 degrees C) leading to nozzle clogging, while increasing the temperature by 20 degrees C above the recommended printing settings decreases resistivity by 15%, but causing degradation of the polymer matrix. The limitations of the FDM technique, related to the dimension accuracy emerging from the layer-by-layer printing approach, greatly influence the samples' cross-section, causing irregular resistivity values for different layer heights. For samples with layer thickness lower than 0.2 mm, regardless of the nozzle diameter (0.5-1 mm), high resistance is attributed to the quality of samples. But for a 1 mm nozzle, we observe stabilized values or resistance for 0.3 to 1 mm layer height. Comparing resistance values and layer height generated from the slicer software, we observe a direct correlation-for a larger height of the sample resistance value decrease. Presented modifications in printing parameters can affect the final resistance by 50%. Controlling several parameters simultaneously poses a great challenge for designing high-efficiency structural electronics.
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