Journal
MICROMACHINES
Volume 13, Issue 6, Pages -Publisher
MDPI
DOI: 10.3390/mi13060972
Keywords
EDM; SiCp; Al; recast layer; residual stress; solidification
Categories
Funding
- National Natural Science Foundation of China [51875074]
- Natural Science Basic Research Project of Education Department of Liaoning Province [JDL2020009]
- Science and Technology Research Project of Science and Technology Hall of Henan Province [212102210314]
Ask authors/readers for more resources
This paper presents a model for studying the change of residual stress during heating and solidification of SiCp/Al composites and successfully validates its accuracy.
To study the change of residual stress during heating and solidification of SiCp/Al composites, a one-way FSI (Fluid Structure Interaction) model for the solidification process of the molten material is presented. The model used process parameters to obtain the temperature distribution, liquid and solid-state material transformation, and residual stress. The crack initiated by the thermal stress in the recast layer was investigated, and a mathematical model of crack tip stress was proposed. The results showed a wide range of residual stresses from 44 MPa to 404 MPa. The model is validated using experimental data with three points on the surface layer.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available
Share Paper
