Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 138, Issue 3, Pages -Publisher
ASME
DOI: 10.1115/1.4033558
Keywords
electronic cooling; double-layer microchannel; transverse-flow; conjugate heat transfer; thermal resistance; temperature uniformity
Funding
- National Research Foundation of Korea (NRF) - Korea Government (MSIP) [2009-0083510]
- National Research Foundation of Korea [2009-0083510] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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The performances of various transverse-flow double-layer microchannel heat sink configurations were evaluated compared to those of parallel-flow heat sink configurations via conjugate heat transfer analysis. For the analysis, three-dimensional Navier-Stokes and energy equations for steady incompressible laminar flow were solved using a finite-volume solver. Water with temperature-dependent thermophysical properties was used as a coolant. The thermal resistances were evaluated for various flow configurations of both cross-channel and parallel-channel designs with identical geometric parameters and total flow rate. Changes in the microchannel flow direction lead to remarkable changes in thermal resistance and temperature uniformity. A transverse-flow configuration exhibited the best overall performance among the tested flow configurations in terms of the thermal resistance, temperature uniformity, and pressure drop.
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