Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 45, Issue 8, Pages 4357-4363Publisher
SPRINGER
DOI: 10.1007/s11664-016-4611-5
Keywords
Thin films; SnO2; oxidation temperature; XRD; RBS
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In this work, SnO2 thin films were prepared by thermal oxidation of Sn in an oxygen-rich atmosphere. The Sn thin films were deposited onto Si (100) substrates by vacuum evaporation, and the properties of the oxide films were investigated as a function of the oxidation temperature. The x-ray diffraction patterns showed that the obtained films have a polycrystalline structure with a preferential orientation along the (101) plane. The film oxidized at 500 degrees C was not completely oxidized. The grain growth of the films was controlled by the pore mobility process. The UV-Vis reflectance spectra revealed an increase in both the refractive index and density of the films, reflecting the densification of the investigated films. The band gap energy decreased from 3.78 eV to 3.62 eV, caused by an increase in charge carrier density due to increased grain size. The increase in film thickness can be explained by the upward diffusion of tin atoms into the oxide film surface and the downward diffusion of oxygen atoms into the metal. The increase in the O/Sn ratio, determined from Rutherford backscattering spectroscopy, indicated enhanced material stoichiometry. Electrical resistivity decreased from 9.7 x 10(-3) Omega cm to 1.7 x 10(-4) Omega cm, which was attributed to the increased grain size.
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