Journal
MATERIALS
Volume 15, Issue 15, Pages -Publisher
MDPI
DOI: 10.3390/ma15155211
Keywords
binary promoter; liquid silicone rubber; thermally conductive; moderate-temperature adhesion
Categories
Funding
- Zhejiang Sucon Silicone Co., Ltd. [Sucon2020051602Y]
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This study developed epoxy- and alkoxy-functionalized siloxanes as adhesion promoters for liquid silicone rubber used in electronic packaging. By adjusting the formulation and curing temperature, high adhesion strength, thermal conductivity, fluidity, and durability were achieved.
The strong adhesion of thermally conductive silicone encapsulants on highly integrated electronic devices can avoid external damages and lead to an improved long-term reliability, which is critical for their commercial application. However, due to their low surface energy and chemical reactivity, the self-adhesive ability of silicone encapsulants to substrates need to be explored further. Here, we developed epoxy and alkoxy groups-bifunctionalized tetramethylcyclotetrasiloxane (D4H-MSEP) and boron-modified polydimethylsiloxane (PDMS-B), which were synthesized and utilized as synergistic adhesion promoters to provide two-component addition-cured liquid silicone rubber (LSR) with a good self-adhesion ability for applications in electronic packaging at moderate temperatures. The chemical structures of D4H-MSEP and PDMS-B were characterized by Fourier transform infrared spectroscopy. The mass percentage of PDMS-B to D4H-MSEP, the adhesion promoters content and the curing temperature on the adhesion strength of LSR towards substrates were systematically investigated. In detail, the LSR with 2.0 wt% D4H-MSEP and 0.6 wt% PDMS-B exhibited a lap-shear strength of 1.12 MPa towards Al plates when curing at 80 degrees C, and the cohesive failure was also observed. The LSR presented a thermal conductivity of 1.59 W m(-1) K-1 and good fluidity, which provided a sufficient heat dissipation ability and fluidity for potting applications with 85.7 wt% loading of spherical alpha-Al2O3. Importantly, 85 degrees C and 85% relative humidity durability testing demonstrated LSR with a good encapsulation capacity in long-term processes. This strategy endows LSR with a good self-adhesive ability at moderate temperatures, making it a promising material requiring long-term reliability in the encapsulation of temperature-sensitive electronic devices.
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