Journal
PROGRESS IN ORGANIC COATINGS
Volume 168, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.porgcoat.2022.106871
Keywords
Laser etched Cu substrate; Polypropylene coating; Mechanical interlocking; Superhydrophobic surface; Corrosion resistance
Funding
- National Natural Science Foundation of China [51871138, U2102212]
- China Postdoctoral Science Founda-tion [2020M681964]
- Shanghai Science and Technology Committee [19010500400]
- Shanghai Rising-Star Program [21QA1403200]
- Ningbo Natural Science Foundation [2021J214]
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In this study, laser etching technique was used to weave the copper substrate, while plasma enhanced chemical vapor deposition (PECVD) method was applied to deposit a superhydrophobic polypropylene (PP) coating on the woven brass substrate, creating a structure with mechanical interlocking and superhydrophobicity. The structure remained intact and showed high impedance after a 24-hour salt spray test.
Fluorine-free, low surface energy coatings are often combined with woven substrates to achieve superhydrophobicity for protection. In this work, laser etching, a green and efficient weaving method, has been employed to weave the Cu substrate. Plasma enhanced chemical vapor deposition (PECVD) has been applied to deposit a non-toxic, superhydrophobic polypropylene (PP) coating on the woven brass substrate (Cu '), enabling a substrate-coating structure with mechanical interlocking (Cu '/PP). The Cu '/PP with mechanical interlocking and superhydrophobicity (The contact angle of Cu '/PP is up to 150 +/- 0.6 degrees) offers high impedance and remains intact after a 24 h salt spray test.
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