On the anisotropic indentation modulus and anisotropic creep behavior of 6-Sn characterized by nanoindentation methods

The influence of the orientation on the indentation modulus, the hardness and the creep properties of high purity 6-Sn (wt.%: 99.999) have been examined. Nanoindentation methods were used in order to evaluate their potential usage for analyzing small volumina commonly found at solder joints. Crystal orientations close to < 100 >, < 110 > and < 001 > were identified using electron backscatter diffraction (EBSD). To determine the indentation modulus and hardness, continuous stiffness measurements (CSM) were carried out with a maximum load of 1 mN. The indentation moduli correspond in basic sequence to Young's moduli calculated using compliance data of single crystalline 6-Sn. The creep properties were investigated using a constant load of 10 mN over a duration of 10 min. An orientation dependence in the obtained values for the indentation modulus, the hardness and the creep properties could be detected by methods of nanoindentation and is discussed in this study.

Automated summary

The influence of orientation on the indentation modulus, hardness, and creep properties of high purity 6-Sn (wt.%: 99.999) was examined using nanoindentation methods. Crystal orientations close to < 100 >, < 110 >, and < 001 > were identified, and continuous stiffness measurements (CSM) and constant load creep tests were performed. The results indicated an orientation dependence in the indentation modulus, hardness, and creep properties.