4.5 Article

Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High-Temperature Electronic Packaging Applications

Journal

MACROMOLECULAR MATERIALS AND ENGINEERING
Volume 307, Issue 12, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/mame.202200351

Keywords

benzoxazine; electronic packaging; epoxy resins; high-temperature stability; molding compounds

Funding

  1. Enterprise-University-Research Prospective Program, Jiangsu Province [BY2018041]
  2. MOE SAFEA [B13025]
  3. Wuxi Chuangda Advanced Materials Co., Ltd.

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This study investigates the curing behavior, processability, and thermal performance of heat-resistant molding compounds made from polyfunctional epoxy resin and diamine-phenol benzoxazine. The compounds exhibit good processability and improved thermal and mechanical properties compared to commercial epoxy molding compounds. The research provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.
Heat-resistant molding of compounds is an indispensable part in encapsulating future electronic power devices. Herein, it is used for polyfunctional epoxy resin (EP) and diamine-phenol benzoxazine (BOZ) as resin matrix, 4,4'-diaminodiphenylmethane (DDM) as curing agent, and iron acetylacetonate (Fe(acac)(3)) as curing accelerator, as well as inorganic fillers and other auxiliaries, to prepare heat-resistant molding compounds. The curing behavior, processability and thermal performance of the EP/DDM/BOZ (EDB) resin blends containing different contents of DDM, BOZ, and Fe(acac)(3) are first systematically investigated. The EDB molding compounds (MCEDB) with suitable BOZ content show good processability, and the molding process can be compatible with that of commercial epoxy molding compounds (EMC). With increasing the BOZ content, the glass transition temperature of cured MCEDB is greatly enhanced to a maximum of 261 degrees C determined by dynamic mechanical analyzer, owing to the hydrogen-bond interaction generated after polymerization of BOZ increasing the rigidity of network chains. Moreover, the cured MCEDB also exhibits higher thermal decomposition stability, better high-temperature (200 degrees C) mechanical properties, and lower water absorption compared to the cured EMC. After high-temperature (200 degrees C) aging for 500 h, the cured MCEDB with suitable BOZ content still maintains outstanding performance. This study provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.

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