☆ 4.6 Article

Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization

JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2022)

Rate this paper

The primary rating indicates the level of overall quality for the paper. Secondary ratings independently reflect strengths or weaknesses of the paper.

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization

Rate this paper

Discover Peeref hubs

Create your own webinar

Export Citation

Share Paper