Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 33, Issue 22, Pages 17745-17756Publisher
SPRINGER
DOI: 10.1007/s10854-022-08637-4
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Funding
- Natural Science Foundation of Guangdong Province [2019A1515011844]
- Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory [ZHD201801, 31512050201]
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The effects of Zn@Sn particles on the microstructure and mechanical properties of Sn58Bi solder were studied. The addition of Zn@Sn inhibited microstructural coarsening and improved the mechanical properties of the solder. The composite solder paste has great potential to be used in the electronic packaging industry.
We proposed Zn@Sn particles to improve the mechanical properties of the Sn-58 wt% Bi (Sn58Bi) solder. The effects of 3, 6, and 9 wt% Zn@Sn particles on the microstructure and mechanical properties of Sn58Bi were investigated. The addition of Zn@Sn to Sn58Bi solder inhibited microstructural coarsening, which mitigated the brittleness of Sn58Bi solder joints during aging. The zinc-rich phases dispersively distributed in the solder joints effectively inhibited the coarsening of the Bi-riched phase. At the same time, Cu5Zn8 instead of Cu6Sn5 formed at the composite solder/Cu interface. After 21 days of aging, the shear strengths of solder joints doped with 6 wt% Zn@Sn decreased from 54.06 to 36.41 MPa. Compared with the undoped solder joints before and after aging, the shear strengths increased by 34% and 173.1%, respectively. Thus, the composite solder paste has great potential to be used as a low-temperature lead-free solder in the electronic packaging industry.
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