4.6 Article

Tailoring thermal and electrical conductivities of a Ni-Ti-Hf-based shape memory alloy by microstructure design

Journal

JOURNAL OF MATERIALS SCIENCE
Volume 57, Issue 25, Pages 12107-12124

Publisher

SPRINGER
DOI: 10.1007/s10853-022-07383-6

Keywords

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Funding

  1. Israel Science Foundation (ISF) [1997/18]
  2. Technion Russell-Berrie Nanotechnology Institute (RBNI)

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This study focuses on the effects of heat treatments on the microstructure, thermal and electrical conductivities of Ni50.9Ti29.6Hf19.5 SMA. The results show that heat treatments significantly affect the microstructure and increase the transformation temperature and thermal conductivity of the alloy.
Shape memory alloys (SMAs) exhibit unique properties, including the ability to restore their original shape by temperature variations. One of the grand challenges of the aerospace industry is to develop SMAs with transformation temperatures above 100 degrees C with high thermal conductivity. This study focuses on the effects of heat treatments on the microstructure, thermal and electrical conductivities of the Ni50.9Ti29.6Hf19.5 SMA that features good combination between transformation temperatures and physical properties desirable for aerospace applications, such as actuators. We found that heat treatments at 550 degrees C or 700 degrees C for 3 or 50 h affect the microstructure significantly, leading to formation of nanometer-size Hf-rich precipitates. As a result, the Martensite-toAustenite phase transformation temperature is shifted from 100 degrees C up to 205 degrees C. Moreover, these heat treatments affect the electrical and thermal conductivities. The maximum room-temperature values of both thermal and electrical conductivities were recorded after heat treatment at 700 degrees C for 3 h and are as high as kappa = 13.1 +/- 0.4Wm(-1) K-1 and sigma = (9 +/- 0.27) x 10(3) Scm(-1), respectively. The correlation between transformation temperature, microstructure, and thermal and electrical conductivities provides us with useful knowledge required for high temperature SMA design. [GRAPHICS] .

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