Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 912, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2022.165248
Keywords
Boron nitride; Polyetherimide; Composite; Thermal conductivity; Magnetically aligned
Categories
Funding
- National Natural Science Foundation of China [51772054]
- Basic and Applied Basic Research Foundation of Guangdong Province [2020B1515120019]
- Shenzhen Science and Technology Innovation Committee [JCYJ20170413152832151, KQTD20170810160424889]
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In this study, hexagonal boron nitride (h-BN) -polyetherimide (PEI) composites were prepared by aligning the h-BN particles using an external magnetic field. The composite exhibited significantly enhanced thermal conductivity and showed potential for microelectronic packaging applications due to its magnetic alignment of h-BN particles.
In this study, hexagonal boron nitride (h-BN) -polyetherimide (PEI) composites were prepared by a simple solution casting method, where the h-BN particles were aligned by an external magnetic field. Prior to the preparation of the composite samples, the h-BN platelets were firstly decorated by iron oxide nanoparticles (Fe3O4) to achieve the desired magnetic properties. Due to the alignment of h-BN particles, the composite exhibited greatly enhanced thermal conductivity along that direction. At a filler loading of 20 wt%, an enhancement of 166% was obtained, compared to that of the unaligned composite. Furthermore, the composite samples showed a low dielectric loss (~ 0.01) with the filling ratio below 20 wt% and a tensile modulus of up to 2.34 GPa. Bearing such thermal conductivity, electrical insulation properties, and mechanical properties, these composites with magnetically aligned h-BN particles show potentials for microelectronic packaging applications.(C) 2022 Elsevier B.V. All rights reserved.
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