4.7 Article

An experimental and simulation study of the role of thermal effects on variability in TiN/Ti/HfO2/W resistive switching nonlinear devices

Journal

CHAOS SOLITONS & FRACTALS
Volume 160, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.chaos.2022.112247

Keywords

Resistive switching memory; RRAM; Temperature characterization; Simulation; Variability; Modeling; Kinetic Monte Carlo; Series resistance

Funding

  1. Spanish Ministry of Science, In-novation and Universities [TEC2017-84321-C4-1-R, TEC2017-84321-C4-2-R, TEC2017-84321-C4-3-R, A.TIC.117, UGR18, B-TIC-624-UGR20, IE2017-5414]
  2. Consejeria de Conocimiento, Investigaci?n y Universidad, Junta de Andalucia (Spain)
  3. FEDER program

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An in-depth simulation and experimental study has been conducted to analyze the thermal effects on the variability of resistive memories. It was found that the variability for all analyzed magnitudes was higher at low temperatures. The study used kinetic Monte Carlo simulations to explain this higher variability based on the morphology and density changes of conductive filaments observed at low temperatures.
An in-depth simulation and experimental study has been performed to analyze thermal effects on the variability of resistive memories. Kinetic Monte Carlo (kMC) simulations, that reproduce well the nonlinearity and stochasticity of resistive switching devices, have been employed to explain the experimental results. The series resistance and the transition voltages and currents have been extracted from devices based on the TiN/Ti/HfO2/W stack we have fabricated and measured at temperatures ranging from 77 K to 350 K. We observed that the variability for all the magnitudes analyzed was much higher at low temperatures. In the kMC simulations, we obtained conductive filaments (CFs) with less compactness at low temperatures. This led us to explain the higher variability, based on the variations of the CF morphology and density seen at low temperatures. (C) 2022 The Authors. Published by Elsevier Ltd.

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