Bending Sensor Based on Controlled Microcracking Regions for Application toward Wearable Electronics and Robotics

A soft bending sensor based on the inverse pyramid structure is demonstrated, revealing that it can effectively suppress microcrack formation in designated regions, thus allowing the cracks to open gradually with bending in a controlled manner. Such a feature enabled the bending sensor to simultaneously have a wide dynamic range of bending strain (0.025-5.4%), high gauge factor (~74), and high linearity (R-2 ~ 0.99). Furthermore, the bending sensor can capture repeated instantaneous changes in strain and various types of vibrations, owing to its fast response time. Moreover, the bending direction can be differentiated with a single layer of the sensor, and using an array of sensors integrated on a glove, object recognition was demonstrated via machine learning. Finally, a self-monitoring proprioceptive ionic electroactive polymer (IEAP) actuator capable of operating in liquid was demonstrated. Such features of our bending sensor will enable a simple and effective way of detecting sophisticated motion, thus potentially advancing wearable healthcare monitoring electronics and enabling proprioceptive soft robotics.

Automated summary

A soft bending sensor based on the inverse pyramid structure is able to suppress microcracks and open cracks gradually, which enables it to have a wide dynamic range of bending strain, high gauge factor, and high linearity. It can capture instantaneous changes in strain and vibrations and differentiate bending direction. This technology has the potential to advance wearable healthcare monitoring electronics and enable proprioceptive soft robotics.