Journal
CASE STUDIES IN THERMAL ENGINEERING
Volume 31, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.csite.2022.101816
Keywords
Sidewall turbulators; Silicon heat sink; Microchannel heat transfer; Laminar flow
Categories
Funding
- Deanship of Scientific Research, Dhahran [DF201016]
- Interdisciplinary Research Center for Renewable Energy and Power Systems, King Fahd University of Petroleum and Minerals
- King Abdullah City for Atomic and Renewable Energy (K.A.CARE), Saudi Arabia
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The design configuration of microchannel heat sinks is crucial for enhancing heat transfer efficiency. This study focuses on the innovative design of a 3D microchannel with turbulators and evaluates its thermal performance under various conditions. The findings suggest that the microchannel with turbulators located at 75% of the channel length with a pitch of 0.75 mm exhibits the highest thermal performance.
The design configuration of the microchannel heat sinks plays a critical role in heat transfer improvement. The microchannel geometry has 3D configurations, which is needed to be incorporated into the analysis. The present study focuses on the innovative design of a 3D microchannel with turbulators and evaluates the thermal performance of the resulting channels. The thermal performance analysis relies on the assessment of Nusselt Number, channel base temperature, pressure drop, and friction factor for various flow Reynold numbers within the range of 200-800. In the design configurations, five cases, having different locations of turbulators on the channel wall, are considered and the effect of three different micmchannel widths (0.05 mm-0.15 mm) along with different wall heat fluxes (1 x 10(6) W/m(2) to 3 x 10(6) W/m(2)) is evaluated for each case. The case, at which the turbulators are located on 75% of channel length with a pitch of 0.75 mm, demonstrates the highest thermal performance with the maximum Nusselt number at Reynolds number of 800. However, turbulator location close to the channel exit (Cases 1 and 5) gives rise to the lowest thermal performance.
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