Full-response model of transient heat transfer of building walls using thermoelectric analogy method

The modeling calculation of heat transfer based on a resistance and capacitance network in building systems is relatively complex. In this study, a full-response model of the thermal circuit transient analysis of wall heat transfer was established based on the thermoelectric analogy mechanism and the transient analysis principle of circuits. The full-response model of wall heat transfer was validated through comparison with experimental results. From the seventh day, the temperatures of the middle and inner surfaces of the wall exhibited significant attenuation and lag compared to the outer surface temperature of the wall. In the same structure and direction, the lag times of the temperatures of inner and outer surfaces of the south walls of the bedroom and study room were 3 h and 9h30min, and the decay temperatures were 5.5 ? and 5.3 ?, respectively. The proposed model improves the adaptability of the thermoelectric analogy resistance and capacitance (RC) network model and shortens the calculation time, providing a theoretical basis for research on multisystem heat transfer.

Automated summary

In this study, a full-response model of thermal circuit transient analysis for wall heat transfer was established based on thermoelectric analogy mechanism and circuit analysis principles. The model was validated by comparing results with experiments, showing significant attenuation and lag in temperatures of middle and inner surfaces of the wall compared to the outer surface. Overall, the proposed model improves adaptability of the thermoelectric analogy resistance and capacitance (RC) network model and provides a theoretical basis for research on multisystem heat transfer.