4.6 Article

Permanent Hydrophobic Surface Treatment Combined with Solvent Vapor-Assisted Thermal Bonding for Mass Production of Cyclic Olefin Copolymer Microfluidic Chips

Journal

ACS OMEGA
Volume 7, Issue 23, Pages 20104-20117

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acsomega.2c01948

Keywords

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Funding

  1. China Scholarship Council (CSC)
  2. Science Foundation Ireland (SFI) [15/RP/B3208, 20/FIP/PL/8741]
  3. Enterprise Ireland [CF-2021-1635-P]

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A surface modification method using solvent vapor-assisted thermal bonding was developed for the fabrication of cyclic olefin copolymer microfluidic chips. The method achieved high bond strength and good channel integrity. Compared to traditional methods, this process has significant advantages and can be easily integrated into production lines for low-cost mass production.
A hydrophobic surface modification followed by solvent vapor-assisted thermal bonding was developed for the fabrication of cyclic olefin copolymer (COC) microfluidic chips. The modifier species 1H,1H,2H,2H-perfluorooctyl trichlorosilane (FOTS) was used to achieve the entrapment functionalization on the COC surface, and a hydrophobic surface was developed through the formation of a Si-O-Si crosslink network. The COC surface coated with 40 vol % cyclohexane, 59 vol % acetone, and 1 vol % FOTS by ultrasonic spray 10 and 20 times maintained its hydrophobicity with the water contact an increasing from similar to 86 to similar to 115 degrees after storage for 3 weeks. The solvent vapor-assisted thermal bonding was optimized to achieve high bond strength and good channel integrity. The results revealed that the COC chips exposed to 60 vol % cyclohexane and 40 voI % acetone for 120 s have the highest bond strength, with a burst pressure of similar to 17 bar, which is sufficient for microfluidics applications such as droplet generation. After bonding, the channel maintained its integrity without any channel collapse. The hydrophobicity was also maintained, proved by the water contact angle of similar to 115 degrees on the bonded film, as well as the curved shape of water flow in the chip channel by capillary test. The combined hydrophobic treatment and solvent bonding process show significant benefits for scale-up production compared to conventional hydrophilic treatment for bonding and hydrophobic treatment using surface grafting or chemical vapor deposition since it does not require nasty chemistry, long-term treatment, vacuum chamber, and can be integrated into production line easily. Such a process can also be extended to permanent hydrophilic treatment combined with the bonding process and will lay a foundation for low-cost mass production of plastic microfluidic cartridges.

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