Journal
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume 17, Issue -, Pages 1438-1449Publisher
ELSEVIER
DOI: 10.1016/j.jmrt.2022.01.085
Keywords
Interfacial reaction; Tensile strength; Isothermal aging; Sn-3.0Ag-0.5Cu solder; Microwave hybrid heating
Funding
- Ministry of Higher Education and University of Malaya
- Tin Industry (Research and Development) Board Research Grant
- [2021]
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In this study, a comparative analysis was conducted to evaluate the influence of isothermal aging on SAC305/Cu solder joints by conventional reflow and microwave hybrid heating (MHH). The results showed that MHH resulted in a thinner Cu6Sn5 layer, smaller grain size, and higher ultimate tensile strength (UTS) compared to conventional reflow, indicating its potential for improving the long-term reliability of solder joints.
Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term reliability of solder joints is still unclear. In this work, a comparative study was carried out on the influence of isothermal aging on SAC305/Cu solder joints by conventional reflow and MHH. The conventional reflow oven was set to 260 C at 60 s holding time, and MHH was carried out at high operating power at 40 s. The reflowed sample was isothermally aged at 150 C for various aging times (0, 240, 480 and 960 h) in a laboratory oven. The conventional reflow and MHH transformed the IMC structure from scallop-like to a planar like Cu6Sn5 with a linear increase in thickness and a thin layer of Cu3Sn was observed at 240 h of aging. While Ag3Sn particles grew larger at longer aging time. The MHH shows a thinner Cu6Sn5 layer, and a smaller grain size compared to conventional reflow. The ultimate tensile strength (UTS) for conventional reflow (32.7 MPa) is 26.8% lower compared to MHH (44.7 MPa). The UTS for MHH is greater than conventional reflow as the isothermal aging time increases.(C) 2022 The Author(s). Published by Elsevier B.V.& nbsp;
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