Application of femtosecond laser etching in the fabrication of bulk SiC accelerometer

Silicon carbide (SiC) is a promising material to fabricate MEMS accelerometers used in extreme environments for vibration monitoring. However, with ultra-high hardness and corrosion resistance, it is difficult to etch bulk SiC by traditional MEMS processing methods. Here, we presented a bulk SiC accelerometer structure and its femtosecond laser deep etching method. Combined with the sensor design and femtosecond laser etching method, the sensitivity of the sensor could be improved and the processing difficulty could be reduced. The sensitive beams and mass block of the designed accelerometer were fabricated by femtosecond laser and high size accuracy with the maximum size error of about 3.1% was achieved. A fillet transition on the sensitive beam can eliminate crack propagation during laser etching and improve the quality of the etched gap. The cross-section of the etched sensitive beam can be regarded as an isosceles trapezoid with a steepness of 84.76 degrees. The laser etching sidewall surface of the beam is smooth with a surface roughness (Sa) of 0.255 mu m. The piezoresistors on the beam of the accelerometer remain stable before and after laser etching. Generally, the results show that femtosecond laser etching is a feasible method to fabricate bulk SiC accelerometers. (C) 2022 The Authors. Published by Elsevier B.V.

Automated summary

This study presents a new method of using femtosecond laser deep etching to fabricate the sensitive beams and mass blocks of silicon carbide (SiC) accelerometers. By using fillet transitions and optimized laser etching parameters, high-precision machining results can be achieved, improving the processing difficulty.