4.6 Article

Demonstration of Acceptor-Like Traps at Positive Polarization Interfaces in Ga-Polar P-type (AlGaN/AlN)/GaN Superlattices

Related references

Note: Only part of the references are listed.
Article Physics, Applied

Acceptor traps as the source of holes in p-type N-polar GaN/(AlN/AlGaN) superlattices

Athith Krishna et al.

Summary: This study experimentally demonstrates the existence of acceptor traps acting as the source of holes in N-polar p-type modulation doped GaN/(AlN/AlGaN) superlattices. The ionization of acceptor traps explains the higher measured hole concentration compared to the dopants used during growth. The study also provides evidence for the charge-balance in systems showing p-type behavior without sufficient doping.

APPLIED PHYSICS LETTERS (2022)

Article Computer Science, Information Systems

Metal Organic Vapor Phase Epitaxy of Thick N-Polar InGaN Films

Nirupam Hatui et al.

Summary: Hillock-free thick InGaN layers were successfully grown on N-polar GaN on sapphire by introducing Mg as an additional surfactant and optimizing the H-2 pulse time. Despite adversely affecting In incorporation, Mg enabled the maintenance of good surface morphology while decreasing growth temperature, resulting in a net increase in In composition. The parameter space of growth temperature and Mg precursor flow for obtaining hillock-free epilayers was mapped out.

ELECTRONICS (2021)

Article Computer Science, Information Systems

Role of Wide Bandgap Materials in Power Electronics for Smart Grids Applications

Javier Ballestin-Fuertes et al.

Summary: This paper analyzes the requirements for power semiconductor characteristics in future smart applications, comparing the existing wide bandgap materials (SiC and GaN) with promising alternatives under research (Ga2O3, AlN, etc.), and concludes that although SiC and GaN are currently the only available WBG materials, they may be replaced by others in the near future.

ELECTRONICS (2021)

Proceedings Paper Engineering, Electrical & Electronic

GaN/AlGaN superlattice based E-mode p-channel MES-FinFET with regrown contacts and >50 mA/mm on-current

A. Raj et al.

Summary: In this study, GaN/AlGaN superlattice based MESFinFET devices were reported with MOCVD regrown p(+) contacts around the fins, achieving a normally-off operation with an on-current of 65 mA/mm and a large I-on/I-off >10^7. This represents a significant advancement in the development of large band gap pFET devices for efficient high voltage CMOS platforms in power conversion applications.

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) (2021)

Proceedings Paper Engineering, Electrical & Electronic

GaN based High Frequency Power Electronic Interfaces: Challenges, Opportunities, and Research Roadmap

Matthew Baker et al.

Summary: This paper reviews the application of new semiconductor devices (such as GaN) in high-power density power electronic interfaces, introduces the research progress on related modeling, switching techniques, and gate drive circuits, and looks forward to the opportunities and challenges in the field of high-frequency PEI in the future.

2021 IEEE POWER AND ENERGY CONFERENCE AT ILLINOIS (PECI) (2021)

Article Engineering, Electrical & Electronic

W-Band Power Performance of SiN-Passivated N-Polar GaN Deep Recess HEMTs

Brian Romanczyk et al.

IEEE ELECTRON DEVICE LETTERS (2020)

Article Engineering, Electrical & Electronic

Demonstration of a GaN/AlGaN Superlattice-Based p-Channel FinFET With High ON-Current

Aditya Raj et al.

IEEE ELECTRON DEVICE LETTERS (2020)

Article Materials Science, Multidisciplinary

AlGaN/GaN Superlattice-Based p-Type Field-Effect Transistor with Tetramethylammonium Hydroxide Treatment

Athith Krishna et al.

PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE (2020)

Article Engineering, Electrical & Electronic

High Linearity and High Gain Performance of N-Polar GaN MIS-HEMT at 30 GHz

Pawana Shrestha et al.

IEEE ELECTRON DEVICE LETTERS (2020)

Article Engineering, Electrical & Electronic

Ultra-high silicon doped N-polar GaN contact layers grown by metal-organic chemical vapor deposition

N. Hatui et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2020)

Article Engineering, Electrical & Electronic

Regrowth-Free GaN-Based Complementary Logic on a Si Substrate

Nadim Chowdhury et al.

IEEE ELECTRON DEVICE LETTERS (2020)

Article Engineering, Electrical & Electronic

Characterization of AlSiO dielectrics with varying silicon composition for N-polar GaN-based devices

Islam Sayed et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2020)

Proceedings Paper Engineering, Electrical & Electronic

A Novel Concept using Derivative Superposition at the Device-Level to Reduce Linearity Sensitivity to Bias in N-polar GaN MISHEMT

Pawana Shrestha et al.

2020 DEVICE RESEARCH CONFERENCE (DRC) (2020)

Article Engineering, Electrical & Electronic

N-Polar GaN-on-Sapphire Deep Recess HEMTs With High W-Band Power Density

Brian Romanczyk et al.

IEEE ELECTRON DEVICE LETTERS (2020)

Article Physics, Applied

Interfacial N Vacancies in GaN/(Al,Ga)N/GaN Heterostructures

Vera Prozheeva et al.

PHYSICAL REVIEW APPLIED (2020)

Review Physics, Applied

The 2018 GaN power electronics roadmap

H. Amano et al.

JOURNAL OF PHYSICS D-APPLIED PHYSICS (2018)

Article Engineering, Electrical & Electronic

Investigation of Mg δ-doping for low resistance N-polar p-GaN films grown at reduced temperatures by MOCVD

Cory Lund et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2018)

Article Multidisciplinary Sciences

Surface Plasmon Coupling in GaN:Eu Light Emitters with Metal-Nitrides

Ioannis E. Fragkos et al.

SCIENTIFIC REPORTS (2018)

Article Engineering, Electrical & Electronic

Gate-Recessed E-mode p-Channel HFET With High On-Current Based on GaN/AlN 2D Hole Gas

Samuel James Bader et al.

IEEE ELECTRON DEVICE LETTERS (2018)

Article Engineering, Electrical & Electronic

Doping of III-nitride materials

Pietro Pampili et al.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2017)

Article Materials Science, Multidisciplinary

Review-The Current and Emerging Applications of the III-Nitrides

Chuanle Zhou et al.

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY (2017)

Article Engineering, Electrical & Electronic

An Experimental Demonstration of GaN CMOS Technology

Rongming Chu et al.

IEEE ELECTRON DEVICE LETTERS (2016)

Article Nanoscience & Nanotechnology

High hole mobility p-type GaN with low residual hydrogen concentration prepared by pulsed sputtering

Yasuaki Arakawa et al.

APL MATERIALS (2016)

Review Engineering, Electrical & Electronic

Current status and scope of gallium nitride-based vertical transistors for high-power electronics application

Srabanti Chowdhury et al.

SEMICONDUCTOR SCIENCE AND TECHNOLOGY (2013)

Article Physics, Applied

Compositional instability in strained InGaN epitaxial layers induced by kinetic effects

Yong Huang et al.

JOURNAL OF APPLIED PHYSICS (2011)

Article Engineering, Electrical & Electronic

Thermopower Study of GaN-Based Materials for Next-Generation Thermoelectric Devices and Applications

Elisa N. Hurwitz et al.

JOURNAL OF ELECTRONIC MATERIALS (2011)

Article Physics, Applied

InGaN/GaN multiple quantum well solar cells with long operating wavelengths

R. Dahal et al.

APPLIED PHYSICS LETTERS (2009)

Article Chemistry, Physical

A gallium-nitride single-photon source operating at 200K

Satoshi Kako et al.

NATURE MATERIALS (2006)

Review Physics, Applied

III-nitride UV devices

MA Khan et al.

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS (2005)