4.6 Article

DRAM Retention Behavior with Accelerated Aging in Commercial Chips

Journal

APPLIED SCIENCES-BASEL
Volume 12, Issue 9, Pages -

Publisher

MDPI
DOI: 10.3390/app12094332

Keywords

dynamic random access memory (DRAM); retention error; accelerated aging; bias temperature instability (BTI); time-dependent dielectric breakdown (TDDB)

Funding

  1. National Science Foundation [CNS-1850241]

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This study examines the retention behavior of commercial DRAM chips through real-time silicon measurements and investigates how the reliability of DRAM cells degrades with accelerated aging. The research finds that retention errors in DRAM chips increase continuously as they age, and aged retention signatures can be used to differentiate recycled DRAM chips.
The cells in dynamic random access memory (DRAM) degrade over time as a result of aging, leading to poor performance and potential security vulnerabilities. With a globalized horizontal supply chain, aged counterfeit DRAMs could end up on the market, posing a significant threat if employed in critical infrastructure. In this work, we look at the retention behavior of commercial DRAM chips from real-time silicon measurements and investigate how the reliability of DRAM cells degrade with accelerated aging. We analyze the retention-based errors at three different aging points to observe the design-induced variations, analyze the pattern dependency, and explore the impacts of accelerated aging for multiple DRAM vendors. We also investigate the DRAM chips' statistical distribution to attribute the vital wear-out effects present in DRAM. We see a continuous increase in retention error as DRAM chips age and therefore infer that the aged retention signatures can be used to differentiate recycled DRAM chips in the supply chain. We also discuss the roles of device signature in DRAM aging and aging-related security implication on DRAM row-hammer error.

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