4.6 Article

Recent Advances in Thermoplastic Microfluidic Bonding

Journal

MICROMACHINES
Volume 13, Issue 3, Pages -

Publisher

MDPI
DOI: 10.3390/mi13030486

Keywords

microfluidic chip fabrication; microfluidic bonding; thermoplastic bonding; polymer microfabrication

Funding

  1. Ministry of Science and Technology (MOST), Taiwan [MOST 110-2221-E-008-047]

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This review paper summarizes the bonding processes for thermoplastic microfluidic devices and compares different bonding strategies to assist researchers in finding suitable bonding methods for microfluidic device assembly.
Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.

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