Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

Glass frit bonding is a widely used technology to cap and seal micro-electromechanical systems on the wafer level using a low melting point glass. Screen printing is the main method to apply glass frit paste on wafers. Screen printing of glass frit paste is usually performed on less sensitive, less critical wafers, normally the capping wafer, because screen printing is a rough process involving the mechanical contact of the screen printing mesh and the wafer. However, for some applications in which contactless patterning of glass frit materials on the device wafers are preferred (e.g., 3D topographies, micro-lens and optics integration) jet dispensing could be a promising approach. Consequently, in this study, wafer-level jetting of glass frit materials on silicon wafers was proposed and investigated. The jetting parameters such as jetting distance, power and temperature were optimized for a glass frit paste. Additionally, the effect of jetted pitch size on the bond-line thickness was assessed. The wafers with jetted glass frit pastes were conclusively bonded in low vacuum and characterized. As a single-step (non-contact) additive approach, the jet printing of glass frit was revealed to be a straightforward, cost-effective and flexible approach with several implications for hermetic packaging.

Automated summary

This study proposes and investigates a new method for using jet printing of glass frit materials at the wafer level. The jetting parameters were optimized and the effect of jetted pitch size on bond-line thickness was assessed. The results reveal that jet printing of glass frit is a straightforward, cost-effective, and flexible approach with significant implications for hermetic packaging.