Journal
SCRIPTA MATERIALIA
Volume 213, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2022.114599
Keywords
Aluminum; Electroplating; Ionic liquid electrolyte; Grain boundary strengthening; Microstructure
Categories
Funding
- Japan Society for the Promotion of Science (JSPS) KAKENHI [19J11122]
- Division for Interdisciplinary Advanced Research and Educa-tion, Tohoku University
- New Industry Creation Hatchery Center (NICHe)
- Micro/Nano Machining Research and Education Cen-ter (MNC) , Tohoku University
- Grants-in-Aid for Scientific Research [19J11122] Funding Source: KAKEN
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In this study, the improvement of surface uniformity and mechanical hardening of electrochemically deposited Al was achieved by the inclusion of a grain growth inhibitor compound. This study has great potential for the utilization of electrochemically deposited Al in microsystems and related technologies.
ABS T R A C T In establishing electrochemically deposited Al as a structural microdevice, its surface uniformity and mechanical properties such as the hardness are of great importance. In this study, an improvement of surface uniformity and mechanical hardening of the film by factors of about 100 and 4, respectively, are reported. Both were associated to the grain size effect, which is attributed to the inclusion of 2-chloronicotinyl chloride additive acting as a grain growth inhibitor in the electrochemical bath. Other important properties, such as the elastic modulus, residual stress and electrical resistivity of the deposit are also studied. This study holds a great potential to pave the way for the utilization of the electrochemically deposited Al in microsystems and related technologies.
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