Surface properties of Al-doped ZnO thin film before and after CF4/Ar plasma etching

Al-doped ZnO (AZO) is considered as an alternative to transparent conductive oxide materials. Patterning and achieving a stable surface are important challenges in the development and optimization of dry etching processes, which must be overcome for the application of AZO in various devices. Therefore, in this study, the etch rate and surface properties of an AZO thin film after plasma etching using the adaptive coupled plasma system were investigated. The fastest etch rate was achieved with a CF4/Ar ratio of 50:50 sccm. Regardless of the ratio of CF4 to Ar, the transmittance of the film in the visible region exceeded 80%. X-ray photoelectron spectroscopy analysis of the AZO thin film confirmed that metal-F bonding persists on the surface after plasma etching. It was also shown that F eliminates O vacancies. Consequently, the work function and bandgap energy increased as the ratio of CF4 increased. This study not only provides information on the effect of plasma on AZO thin film, but identifies the cause of changes in the device characteristics during device fabrication.

Automated summary

This study investigates the etch rate and surface properties of an AZO thin film after plasma etching. The fastest etch rate was achieved with a CF4/Ar ratio of 50:50. Regardless of the ratio of CF4 to Ar, the transmittance of the film in the visible region exceeded 80%. X-ray photoelectron spectroscopy analysis confirmed the presence of metal-F bonding on the surface after plasma etching.