Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 841, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2022.143038
Keywords
Cu alloys; Softening resistance; Strength; Conductivity
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Funding
- National Key R&D Program of China [2021YFB2500600]
- National Natural Science Foundation of China [11725210, 51827810, 51977193]
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A nanocompound-induced anti-softening mechanism is proposed to prepare high strength and high conductivity CuCr alloys with favorable softening resistance. Co and Ti compounds are added to the CuCr alloy to suppress the coarsening of Cr precipitates and inhibit recrystallization. As a result, the CuCrCoTi alloy exhibits a higher softening temperature.
A nanocompound-induced anti-softening mechanism is proposed for preparing high strength and high conductivity CuCr alloys with favorable softening resistance. The mechanism is to introduce nanocompound at the Cu/Cr interface to suppress the coarsening of Cr precipitate. To verify the mechanism, Co and Ti are added to the CuCr alloy. CoTi compounds precipitate around the Cr precipitates after aging treatment. The coarsening of Cr and CoTi phases are both suppressed thanks to the low diffusion rates of Co and Ti atoms in Cu. Additionally, Cr and CoTi precipitates also inhibit the recrystallization. As a result, the CuCrCoTi alloy displays a higher softening temperature (> 600 & nbsp;) than CuCr alloys.
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