Highly thermally conductive Ti3C2Tx/h-BN hybrid films via coulombic assembly for electromagnetic interference shielding

With the development of electronic equipment, heat problem and electromagnetic pollution severely affect both their functions and human health, which leads to great interests in developing materials synchronously with outstanding thermal conductivity and electromagnetic interference (EMI) shielding performance. Here, ultrathin Ti3C2Tx/h-BN two-dimensional (2D) heterostructure films were prepared via coulombic assembly between Ti3C2Tx MXene and h-BN nanosheet through ultrasonic blending. After the addition of h-BN nanosheet as thermal conductive nanofillers, the hybrid films achieved a higher value of thermal conductivity, compared to Ti3C2Tx composite film without h-BN. The higher thermal conductivity offered by h-BN enables the Ti3C2Tx/h-BN films have good potential for EMI shielding applications on wearable and portable electronic devices. When the mass ratio of Ti3C2Tx/h-BN is 7:3, the hybrid film with the thickness of 47.60 mm exhibited electrical conductivity of 57.67 S/cm and the maximum EMI shielding effectiveness of 37.29 dB. (C) 2022 Elsevier Inc. All rights reserved.

Automated summary

In this study, ultrathin Ti3C2Tx/h-BN 2D heterostructure films were prepared, which exhibited excellent thermal conductivity and electromagnetic interference (EMI) shielding performance, making them suitable for wearable and portable electronic devices.