Fabrication, characterization, and thermoelectric properties of soft polyurethane foam loaded with semiconducting poly(3-hexylthiophene) nanofibers

A polyurethane foam (PUF) loaded with poly(3-hexylthiophene) (P3HT) nanofibers is fabricated as a thermoelectric (TE) material with low-thermal conductivity. To date, there have been no reports on PUFs loaded with organic fillers, including conducting polymers, exhibiting TE properties. The P3HT nanofibers do not affect the polyurethane foaming reaction and are uniformly dispersed in the PUF. Generally, conductive fillers, including carbon fillers, result in brittle PUFs. However, the PUFs loaded with P3HT nanofibers exhibit mechanical strength and Young's modulus comparable to the PUFs without fillers, and the thickness can be completely restored even after compressing 20 times. Finally, it is confirmed that the PUF loaded with P3HT nanofibers exhibits TE properties, and the Seebeck coefficient is approximately 3 mV K-1, which is comparable to that of the conventional P3HT film reported previously. The soft PUF loaded with P3HT nanofibers can be regarded as a TE material with flexibility, mechanical toughness, and low-thermal conductivity.

Automated summary

A polyurethane foam loaded with P3HT nanofibers is developed, which exhibits low thermal conductivity and thermoelectric properties while maintaining high mechanical strength and modulus.