4.7 Article

How natural convection affect cooling performance of PCM heat sink

Journal

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2021.122272

Keywords

Phase change materials; Natural convection; Heat sink; Electronic components; Quantified contribution

Funding

  1. National Natural Science Foundation of China [51906257, 51806185]
  2. Major Program of Nature Science Foundation of Shandong Province [ZR2019ZD11]

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This study investigates the quantified contribution of natural convection in phase change material (PCM) heat sinks, and discusses the effects of heat flux and physical parameters on temperature and safe working time. The results show that the cooling performance gradually shifts from heat conduction to natural convection during the temperature fluctuation stage. Natural convection can improve the heat dissipation performance, and correlations are established to predict natural convection under different heat flux conditions.
Phase change materials (PCMs) present great potential in extending the safe working time of electronic components that work intermittently or in an adiabatic cavity. Therefore, a clear understanding of the quantified contribution of natural convection and heat conduction in the cooling performance of PCM heat sink is essential to prolong the safe working time. In this paper, the quantified contribution of natural convection (eta) was experimentally investigated by changing the heating position (bottom heat and top heating). Moreover, the effects of heat flux (q) and physical parameters were discussed on the average temperature during the overall fluctuation stage (T-af), the eta, safe working time, etc. The results proved that the dominant factor for the overall melting process of paraffin gradually changed from heat conduction to natural convection when the temperature fluctuation stage appeared. Specifically, the cooling performance of the PCM heat sink at q = 1.24 similar to 3.11 W.cm(-2) could be improved by natural convection for 50%similar to 58.7%, which depended on the T-af. Moreover, correlations consisted of the maximum allowable temperature, the liquidus temperature, and the heat flux were obtained to predict the eta of paraffin in the range of q = 1.24 similar to 3.73 W.cm(-2). It also presented an acceptable error (17%) in predicting the eta of other organic PCMs. It should be noted that some synergistic enhancement technologies for heat conduction and natural convection should be developed in future works to prolong the safe working time of electronic components with high heat flux and low allowable temperature. (c) 2021 Elsevier Ltd. All rights reserved.

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