Journal
ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE
Volume 109, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.engappai.2022.104663
Keywords
Dimensionality reduction; Variable selection; Feature selection; Deep learning; Semiconductor manufacturing; Wafer profile reconstruction
Categories
Funding
- Irish Manufacturing Research (IMR)
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Reducing data dimensionality is crucial for improving model performance in data analysis applications, and unsupervised variable selection techniques can help select the best subset of variables without prior information. The Recovery of Linear Components (RLC) method strikes a balance between linear and non-linear techniques, providing higher accuracy, similar robustness, and faster training times compared to similar complex autoencoders.
Reducing dimensionality is a key preprocessing step in many data analysis applications to address the negative effects of the curse of dimensionality and collinearity on model performance and computational complexity, to denoise the data or to reduce storage requirements. Moreover, in many applications it is desirable to reduce the input dimensions by choosing a subset of variables that best represents the entire set without any a priori information available. Unsupervised variable selection techniques provide a solution to this second problem. An autoencoder, if properly regularized, can solve both unsupervised dimensionality reduction and variable selection, but the training of large neural networks can be prohibitive in time sensitive applications. We present an approach called Recovery of Linear Components (RLC), which serves as a middle ground between linear and non-linear dimensionality reduction techniques, reducing autoencoder training times while enhancing performance over purely linear techniques. With the aid of synthetic and real world case studies, we show that the RLC, when compared with an autoencoder of similar complexity, shows higher accuracy, similar robustness to overfitting, and faster training times. Additionally, at the cost of a relatively small increase in computational complexity, RLC is shown to outperform the current state-of-the-art for a semiconductor manufacturing wafer measurement site optimization application.
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