Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 156, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2022.106891
Keywords
A; Polymer-matrix composites (PMCs); Layered structures; B; Thermal properties; Bidirectional freezing assembly
Funding
- National Natural Science Foundation of China [21878218]
- Tianjin Science and Technology Major Project [18ZXSZSF00030]
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Thermal-conductive yet electrical-insulating polymer composites are urgently needed for efficient heat dissipation in modern microelectronics. However, the thermal conductivity of polymer composites under low filler loadings is unsatisfactory. In this study, a 3D lamellar-structured fluorinated boron nitride nanosheets (FBNNS)/graphene oxide (GO) skeleton was prepared to facilitate heat flow and reduce thermal resistance. The resulting composite exhibited high thermal conductivity, excellent mechanical properties, superior dimensional stability, and electrical insulation.
Thermal-conductive yet electrical-insulating polymer composites are in urgent demand in modern microelectronics for efficient heat dissipation. However, the reported through-plane thermal conductivity of polymer composites under low filler loadings (< 10 vol%) is dissatisfactory, due to undesirable heat transfer pathways and high interfacial thermal resistance. Herein, 3D lamellar-structured fluorinated boron nitride nanosheets (FBNNS)/graphene oxide (GO) skeleton prepared by bidirectional freezing assembly ensures the directional motion of heat flow, in which GO bridges adjacent F-BNNS for reducing thermal resistance via hydrogen bond of H-F and van der Waals interaction. After vacuum-infiltrating polydimethylsiloxane (PDMS), the 9.5 vol% F-BNNS/GO/ PDMS presents fascinating characteristics: a high through-plane thermal conductivity of 3.28 W.m(-1).K-1 and an excellent tensile strength of 3.19 MPa, with the enhancements of 1829% and 118% respectively compared to pure PDMS; besides, superior dimensional stability and electrical insulation were obtained, with thermal expansion coefficient of 79 ppm/K and volume resistivity of 2.45 x 10(12) omega.cm.
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