4.7 Article

Improved thermal conductivity and mechanical property of mercapto group-activated boron nitride/elastomer composites for thermal management

Journal

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2022.106869

Keywords

Boron nitride nanosheets; Thermal conductivity; Ionic liquid; Surface activation

Funding

  1. Technology Innovation Program (or Industrial Strategic Technology Development Program-Development of technology on materials and components ) - Ministry of Trade, Industry & Energy (MOTIE, Korea) [20010106]
  2. Korea Evaluation institute of Industrial Technology (KEIT) through the Carbon Cluster Construction project - Ministry of Trade, Industry & Energy (MOTIE, Korea) [10083586]

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In this study, boron nitride nanosheets were fabricated using ionic liquid and surface activation techniques, and incorporated into a rubber matrix for thermal management materials. The resulting material showed superior mechanical properties and thermal conductivity, demonstrating its potential as a thermal management material for electronic devices.
Ionic liquid 1-Ethyl-3-methylimidazolium chloride was employed to promote the exfoliation of hexagonal boron nitride (BN) to fabricate the boron nitride nanosheets (BNNSs). The BNNSs were then surface activated by covalently attaching mercapto groups on their surfaces. The surface-activated BNNS nanoparticles (S@BNNSs) were incorporated in a carboxylated styrene-butadiene rubber matrix for preparing thermal management materials. The developed material was provided with superior mechanical properties, satisfied thermal conductivity and strong storage modulus attributing to the two-dimensional structure of the filler and the enhanced interfacial interaction between the filler and matrix. The filler-filler and filler-matrix networks in the composite system were comprehensively analyzed. The thermal management applications were also demonstrated using an infrared camera and a commercial thermoelectric generator. All the performances demonstrated their potential use as thermal management materials in electronic devices.

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