☆
4.3
Article
Proceedings Paper
300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology
JAPANESE JOURNAL OF APPLIED PHYSICS (2016)
Rate this paper
The primary rating indicates the level of overall quality for the paper. Secondary ratings independently reflect strengths or weaknesses of the paper.
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationCreate your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create Now