Crackless glass through-structure fabrication with laser-induced backside wet etching using detachably bonded cover

We propose a novel process for fabricating crackless high aspect ratio glass through-structures in this study. A glass mate-rial was machined using laser-induced backside wet etching (LIBWE) and a detachably bonded glass cover. The uncon-trolled spread of the liquid absorbent was prevented, which inhibited the crack generation by plasma-activated bonding and local fusion between the cover and workpiece. High aspect ratio crackless through-structures could be fabricated with inexpensive machining devices. The machined quality was investigated based on the machining principle of LIBWE. In the final step, various glass structures were machined to verify the range of machinable geometry.(c) 2022 The Authors. Published by Elsevier Ltd on behalf of CIRP. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)

Automated summary

In this study, a novel process for fabricating crackless high aspect ratio glass through-structures is proposed using laser-induced backside wet etching (LIBWE) and a detachably bonded glass cover. The process allows for the fabrication of high aspect ratio crackless structures with inexpensive machining devices, while inhibiting crack generation.