4.7 Article

Microstructure and properties of the AlCrMoZrTi/(AlCrMoZrTi)N multilayer high-entropy nitride ceramics films deposited by reactive RF sputtering

Journal

CERAMICS INTERNATIONAL
Volume 48, Issue 12, Pages 16901-16911

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2022.02.245

Keywords

High-entropy nitride ceramics film; Modulation period; Microstructure; Mechanical property; Tribological behavior

Funding

  1. National Natural Science Foundation of China [11974316]
  2. National Natural Sci-ence Foundation of China [12104409]
  3. Key scientific research project plan of colleges and universities in Henan Province [22A430014]

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AlCrMoZrTi/(AlCrMoZrTi)N multilayer high-entropy nitride ceramic films fabricated by reactive RF magnetron sputtering exhibited preferentially oriented FCC crystal structures. The films with larger modulation period had higher nitrogen content and surface roughness, weaker template effect, and decreased interface structure. The film with a modulation period of 1500 nm had the highest hardness and modulus. The film with the smallest modulation period showed stable friction coefficient and small wear rate.
The AlCrMoZrTi/(AlCrMoZrTi)N multilayer high-entropy nitride ceramic films (HENCFs) fabricated by reactive RF magnetron sputtering presented (200) preferentially oriented FCC crystal structures. With the increase in the modulation period, the nitrogen content and surface roughness of the multilayer films gradually increased, the template effect between the nanocrystalline and amorphous forms was weakened, and the multilayer interface structure decreased. The S4 film with a modulation period of 1500 nm had the highest hardness and modulus (16.6 and 225.7 GPa, respectively) and the highest H/E* and H-3/E*(2) values. The results of friction experiments showed that the S1 film with the smallest modulation period had a stable friction coefficient and small wear rate on both Si and Cu substrates, and it exhibited the best friction and wear performance due to its low surface roughness, high toughness and compressive yield resistance, and dense multilayer structure. The friction mechanisms of the HECNFs on Si and Cu substrates were mainly adhesive wear, abrasive wear, and a small amount of oxidative wear.

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