Journal
CARBON
Volume 189, Issue -, Pages 265-275Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2021.12.067
Keywords
Thermal interface materials; Thermal conductivity; Graphene; Joule heating
Funding
- University Development Fund [UDF0100152]
- National Natural Science Foundation of China [52102368]
- Program for Guangdong Introducing Innovative and Entrepreneurial Teams [2017ZT07C291]
- Shenzhen Science and Technology Program [KQTD20170810141424366]
- China Postdoctoral Science Foundation [2020M680085, 2021T140638]
- Regional Joint Fund for Basic Research and Applied Basic Research of Guangdong Province [2020SA001515110905]
- Shenzhen Natural Science Foundation [GXWD20201231105722002-20200824163747001]
Ask authors/readers for more resources
This study proposes a strategy to construct thermal interface materials (TIMs) with bidirectional high thermal conductivity by incorporating micron-diamonds (MDs) in graphene nanoplatelets/nanofibrillated cellulose (GNPs/NFC) composite film. The loading and particle size of MDs can be adjusted to achieve high thermal conductivity in both in-plane and through-plane directions.
Environmentally friendly thermal interface materials (TIMs) with bidirectional high thermal conductivities have aroused considerable interests for addressing the heat dissipation issue in integrated circuits. Although graphene-based TIMs exhibit excellent in-plane thermal conductive performance, their through-plane thermal conductivity is commonly less than 3 Wm(-1)K(-1) owing to the vast interfacial phonon scattering, significantly limiting their practical applications. In this study, a strategy aimed at building TIMs with controllable heat transfer pathways both along the in-plane and through-plane directions is proposed by incorporating micron-diamonds (MDs) in graphene nanoplatelets/nanofibrillated cellulose (GNPs/NFC) composite film via a facile and green self-assembly method. The morphology of the obtained MDs@GNPs/NFC composite film can be precisely tailored from a hierarchical structure to a 3D solid foam-like structure to tailor heat transfer paths. By adjusting the loading and particle size of MDs, a through-plane thermal conductivity of 8.85 Wm(-1)K(-1) was achieved accompanied with a simultaneously high in-plane thermal conductivity of 32.01 Wm(-1)K(-1). The excellent bidirectional thermal conductive performance is integrated with high-efficiency Joule heating capability, outstanding nonflammability, as well as superior electromagnetic shielding performance, showing a promising future in advanced electronic devices. (C) 2021 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available