4.5 Article

263 nm wavelength UV-C LED on face-to-face annealed sputter-deposited AlN with low screw- and mixed-type dislocation densities

Journal

APPLIED PHYSICS EXPRESS
Volume 15, Issue 5, Pages -

Publisher

IOP Publishing Ltd
DOI: 10.35848/1882-0786/ac66c2

Keywords

AlN; sputtering; annealing; UV-C LED; AlGaN

Funding

  1. MEXT Program for Building Regional Innovation Ecosystems, JSPS KAKENHI [19K15025, 21K04903, 21K14545]
  2. JST CREST [16815710]
  3. JST FOREST [JPMJFR203I]
  4. JST SCORE, JST aXis [JPMJAS2011]
  5. Ministry of Economy, Trade, and Industry Monozukuri R&D Support Grant Program for SMEs [JPJ005698]
  6. GaN Consortium
  7. NEDO leading research program
  8. Grants-in-Aid for Scientific Research [21K14545, 21K04903, 19K15025] Funding Source: KAKEN

Ask authors/readers for more resources

In this study, we optimized the sputter-deposition conditions for AlN and MOVPE growth conditions for AlGaN to reduce hillock density and size. After achieving surface-flattening of AlGaN, UV-C LEDs with a wavelength of 263 nm were fabricated on FFA Sp-AlN, and maximum external quantum efficiencies of approximately 4.9% and 8.0% were achieved without and with silicone encapsulation, respectively.
Regarding deep-ultraviolet optical device applications, face-to-face annealed sputter-deposited AlN (FFA Sp-AlN) is a promising alternative to the conventional metalorganic vapor phase epitaxy (MOVPE)-prepared AlN templates on sapphire substrates. However, FFA Sp-AlN tends to exhibit AlGaN growth-related hillock generation and surface morphology deterioration. In this study, we optimized the sputter-deposition conditions for AlN and MOVPE growth conditions for AlGaN to respectively reduce hillock density and size. After confirming AlGaN surface-flattening, we fabricated 263 nm wavelength UV-C LEDs on the FFA Sp-AlN and achieved maximum external quantum efficiencies of approximately 4.9% and 8.0% without and with silicone encapsulation, respectively.

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