4.6 Article

Synthesis of diamond crystal growth on tungsten carbide inserts by HFCVD using various seeding powders

Journal

Publisher

SPRINGER HEIDELBERG
DOI: 10.1007/s00339-022-05417-z

Keywords

SPUN cemented carbide; HFCVD; Surface characterization; Grain size; Microhardness; Cutting tools

Funding

  1. AICTE-RPS-2009 [8023/BOR/RID/RPS-142/2008-09]

Ask authors/readers for more resources

The HFCVD process is used to synthesize diamond crystals on the WC-Co SPUN inserts. Different seeding materials result in different crystal formation and properties, with the best performance observed for tantalum and diamond powders.
The hot filament chemical vapor deposition (HFCVD) process is used to synthesize diamond crystals on cemented carbide (WC-Co) SPUN inserts. Diamond (Dia.), carbon (GC-glassy spherical form), iridium (Ir), molybdenum (Mo), palladium (Pd), platinum (Pt), tungsten (W), and tantalum (Ta) powders were used as seeding materials for crystal growth. Scanning electron microscopy (SEM) data revealed the development of a few diamond crystals in platinum, iridium, and tungsten powders. The seeding with carbon, tantalum, and diamond powders formed clustered microcrystalline diamond (MCD) crystals, although other powders produced discrete crystals. Tantalum and diamond-seeded powders produced the most significant number and size of crystals. According to micro-Raman spectroscopy (mu-RS), tantalum powder had the lowest I-D/I-G ratio and the most excellent sp(3) bonding. X-ray diffraction (XRD) revealed the maximum diamond intensity in the (111) plane. According to atomic force microscopy (AFM), diamond and molybdenum powders had the largest grains, whereas tantalum powder had the smallest root mean square roughness value with a homogeneous grain distribution. The Vickers microhardness (VHN) test confirmed the highest hardness value for diamond and tantalum seeded powder coatings with the least amount of radial cracking. Field emission scanning electron microscopy (FESEM) revealed that both powders had higher film thickness values.

Authors

I am an author on this paper
Click your name to claim this paper and add it to your profile.

Reviews

Primary Rating

4.6
Not enough ratings

Secondary Ratings

Novelty
-
Significance
-
Scientific rigor
-
Rate this paper

Recommended

No Data Available
No Data Available