Journal
ACTA MATERIALIA
Volume 226, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2021.117616
Keywords
Thermoelectric interface materials; Mg3Sb1.5Bi0.5; bonding strength; interfacial resistivity; interfacial thermal stability
Funding
- National Key Project of Research and Development Plan [2018YFB0703600]
- NSFC Program [51872133]
- Guangdong Innovative and Entrepreneurial Research Team Program [2016ZT06G587]
- Shenzhen Key Projects of Long-Term Support Plan [2020 09251640210 02]
- Guangdong Provincial Key Laboratory Program-Department of Science and Technology of Guangdong Province [2021B1212040 0 01]
- Tencent Foundation-XPLORER PRIZE
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This study proposes an alloying approach to generate thermoelectric interface materials (TEiMs) for improved reliability of thermoelectric power generators (TEGs). Through careful selection of matrix elements and optimization of interface design strategies, ternary alloys with excellent performance and thermal stability were obtained.
The reliability of thermoelectric power generators (TEGs) depends heavily on the contact interface between thermoelectric (TE) materials and electrodes. We propose a general alloying approach for generating TE interface materials (TEiMs) for n-type Mg3Sb1.5Bi0.5 systems. The TEiM serves as a metallisation layer or barrier that precedes the soldering assembly. We first selected Fe from 15 elements as the matrix element considering the criteria of high bonding strength and low interfacial resistivity. Following the principles of high bonding propensity, coefficient of thermal expansion (CTE) matching, diffusion passivation, and dopant inactivation, two types of ternary alloys (Fe7Mg2Cr and Fe7Mg2Ti) with shear strengths (crs) of > 40 MPa and the specific contact resistivities (rho(c) ) of < 5 mu omega cm(2) were obtained. Furthermore, the thermal stability of the TEiM/Mg3Sb1.5Bi0.5 contact interface was investigated employing aging treatment. The contact interface exhibited high shear strength (sigma(s) > 30 MPa ), low specific contact resistivity (rho(c) < 10 mu omega cm(2)), and excellent thermal stability after aging treatment at 400 ? for 15 days. The general TEiM design strategy presented herein will contribute to further optimization of contact interfaces in TEG devices. (C) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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