4.7 Article

Thermoelastic waves in a fractional-order initially stressed micropolar diffusive porous medium

Journal

JOURNAL OF OCEAN ENGINEERING AND SCIENCE
Volume 6, Issue 4, Pages 376-388

Publisher

ELSEVIER
DOI: 10.1016/j.joes.2021.04.001

Keywords

Micropolar; Thermodiffusion; Void; Fractional-order thermoelasticity; Initial stress; Plane-wave

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The research article analyzes the wave propagation in an initially stressed micropolar fractional order derivative thermoelastic diffusion medium with voids. Different types of plane waves are identified, each exhibiting unique characteristics influenced by the presence of thermal, diffusion, and void parameters in the medium. The speeds of the plane waves were determined for a specific material and plotted against various parameters for further analysis.
The research article is the analysis of wave propagation in an initially stressed micropolar fractional order derivative thermoelastic diffusion medium with voids. The governing equations in the context of generalized fractional-order derivative thermo-elasticity are formulated and the velocity equations are obtained. The plane wave solution of these equations indicates the existence of six plane waves, namely coupled longitudinal displacement (cL), coupled thermal (cT), coupled mass diffusion (cMD), coupled longitudinal void volume fraction (cV), coupled transverse displacement (cT D), and coupled transverse micro-rotational (cT M) waves. The sets of coupled waves (cL), (cT), (cMD) and (cV) are found to be dispersive, attenuating and influenced by the presence of thermal, diffusion and voids parameters in the medium. The speeds of coupled transverse displacement (cT D ), and coupled transverse micro-rotational (cT M) waves are not affected by thermal, diffusion and void parameters. The speeds of the plane waves, cL, cT, cMD, andcV are computed for a particular material and plotted against the thermal parameter, frequency, initial stress, diffusion and void parameters. (C) 2021 Shanghai Jiaotong University. Published by Elsevier B.V.

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