4.5 Article

Thermo-responsive and electro-active shape memory poly (styrene-b-isoprene-b-styrene)/poly(ethylene-co-1-octene)/graphene composites: Effect of size of graphene nanoplatelets

Journal

FLATCHEM
Volume 31, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.flatc.2021.100319

Keywords

Smart materials; Electro-active shape memory; Polymer composites; Thermoplastic elastomers; Graphene

Funding

  1. Yalova University Scientific Research Projects Coordination Department [2019/AP/0018]

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In this study, thermally and electrically triggered polymeric composites were prepared using graphene nanoplatelets as conductive fillers. The results showed that the size of the graphene fillers played a crucial role in shaping memory performance, with larger size fillers aiding in shape fixing and smaller size fillers enhancing shape recovery ability. Additionally, the thermal stability of the composites was significantly improved with the addition of graphene fillers.
Thermally and electrically triggered poly(styrene-b-isoprene-b-styrene) (SIS) and poly(ethylene-co-1-octene) (PEO) thermoplastic elastomer blend composites having a SIS/PEO weight ratio of 40/60 were prepared by melt blending method. Two different graphene nanoplatelets (GnPs) with different sizes (small size (SG) and big size (BG)) were used as conductive fillers at different amounts. The thermo-responsive and electro-active shape memory performances of the composites as well as their morphological, mechanical and thermal properties were investigated by paying attention to the effect of size and loading degree of the graphene nano-fillers. Both the BG and the SG improved elastic modulus with increase in amount of the fillers. The modulus values increased by 553 % and 507 % for the 50BG and 50SG composites having 50 phr GnPs respectively, as compared to the blend. Heat-triggered thermo-mechanical shape memory tests showed that the BG filler is more advantageous for shape fixing whereas the SG filler is favorable to shape recovery ability. The electrical percolation threshold was achieved at relatively lower content for the BG filler. The 50BG composite exhibited electro-active shape recovery under 25 V, while the SG composite recovered its shape under 65 V. The thermal stability of the blend significantly improved by the use of the both fillers. The degradation onset temperatures of the 50SG and the 50BG composites increased by 25 degrees C and 10 degrees C, respectively, compared to the blend.

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